MEMS Fabrication

QPAC® is suitable as a sacrificial layer for forming encapsulated air-channels in MEMS and microfluidic device fabrication.

Key benefits:

  • Decomposition advances linearly with time.
  • QPAC® is naturally “tacky” and and provides excellent adhesion to substrates.
  • Decomposition can occur in a wide range of sintering atmospheres including air, oxygen, nitrogen, hydrogen, argon, and vacuum.
  • Decomposition at low temperatures. QPAC® decomposes completely between 220 C – 350 C, which can be 100 C or more below the decomposition temperatures of other binders.
  • Upon decomposition, QPAC® leaves virtually no residue or contamination.
  • QPAC® produces benign emissions; products of combustions are carbon dioxide and water vapor, which are non-toxic, non-flammable, and environmentally safe.

Applications include:

  • MEMS microfluidic devices in polyamide (SU-8)
  • LTCC chip modules