Electronic Passive Components

QPAC® is ideally suited in electronic applications as a processing binder for ceramic, metal, and cermet powders. This includes pressing, sintering, and injection molding operations to fabricate electronic pastes and parts and tape casting.

QPAC® has superior binder burn-off characteristics compared to other binders such as polyvinyl butyral (PVB) and ethyl cellulose.

QPAC® binders also have excellent film forming and coating capabilities, making them an excellent choice for the tape casting process. With the trend toward miniaturization of electronic components, these features are more important than ever.

Key Benefits:

  • Decomposition at low temperatures. QPAC® decomposes completely between 220°C – 350°C, which can be 100°C or more below the decomposition temperatures of other binders.
  • Decomposition can occur in a wide range of atmospheres including air, oxygen, nitrogen, hydrogen, argon, and vacuum.
  • Upon decomposition, QPAC® leaves less than 10 ppm ash residue with the complete burn-out of carbon.
  • QPAC® is soluble in many common solvents.
  • The controlled polymer debinding process allows for improved part structure and pore size management.
  • The use of QPAC® binders allows for parts with excellent green strength and density.
  • QPAC® has excellent film-forming and coating capabilities.

Applications include:

  • Fabrication of capacitors (tantalum, MLCC, LTCC, PZT, AlN)
  • Piezoelectronics
  • Semiconductors
  • Resistors
  • Packaging

QPAC® binds the following:

  • ceramic
  • metal
  • glass
  • cermet
  • conductors

Binders for Electro Ceramics Overview