Brazing Pastes and Solutions

QPAC® is ideally suited for use as an organic binder in brazing pastes and solutions and in soldering pastes.

Key benefits:

  • QPAC® is compatible with a variety of filler metals.
  • QPAC®’s viscosities and molecular weights can be custom-tailored for specific solution or paste requirements.
  • Both grades of QPAC® are naturally “tacky” and their degrees of plasticity can be adjusted as necessary.
  • Decomposition is complete through three phases: solid, liquid, and vapor.
  • QPAC® decomposes completely between 220°C – 350°C, which can be as much as 100°C below the decomposition temperatures of other binders.
  • Upon decomposition, QPAC® leaves very low ash residue with the complete burn-out of carbon.
  • QPAC® produces benign emissions; products of combustions are carbon dioxide and water vapor, which are non-toxic, non-flammable, and environmentally safe.
  • QPAC® is suitable in all sintering atmospheres.
  • Using QPAC® as a binder in brazing pastes and flux improves capillary action through joint.

Industry applications include:

  • Metal Brazing
  • Automotive
  • HVAC & Appliances
  • Aircraft – Aerospace
  • Electronics

Binders for Brazing Overview